Synthesis of silicon carbide (SiC) micro-particles from PCB waste through dry milling as a candidate for microfluidic particles in quenching media

Authors

  • Rifqi Aditya Rehanda Department of Metallurgical and Materials Engineering, Faculty of Engineering, Univeritas Indonesia, Depok, West Java, 16424, Indonesia
  • Myrna Ariati Mochtar Department of Metallurgical and Materials Engineering, Faculty of Engineering, Univeritas Indonesia, Depok, West Java, 16424, Indonesia
  • Wahyuaji Narottama Putra Department of Metallurgical and Materials Engineering, Faculty of Engineering, Univeritas Indonesia, Depok, West Java, 16424, Indonesia

DOI:

https://doi.org/10.61511/hcr.v2i1.1800

Keywords:

ball to powder ratio, dry milling, particle size, PCB, SiC

Abstract

Background: The increasing demand for electronic devices due to technological advancements has led to a rise in electronic waste, particularly printed circuit boards (PCBs). This study aims to utilize PCB waste, which contains non-metal particles such as silicon (Si) and silicon carbide (SiC), to enhance the thermal conductivity of cooling media. Methods: The research process began with the crushing of PCBs, followed by leaching with 1M HCl for 24 hours. Subsequently, pyrolysis was conducted using argon at 500°C for 30 minutes. The resulting PCB particles were then subjected to dry milling in a planetary ball mill with varying ball-to-powder ratios of 1:10, 1:30, and 1:50 for durations of 10 and 20 hours, using steel balls. The milled particles were characterized using X-ray fluorescence (XRF), X-ray diffraction (XRD), and particle size analysis (PSA). Findings: XRF analysis revealed that SiO2 was the predominant compound. XRD results indicated significant SiC phase growth in the 1:50 parameter with a 20-hour milling time. PSA results showed the smallest particle size of 627.6 d.nm with a polydispersity index of 0.047 in the 1:10 variable with a 20-hour milling time. Conclusion: The study successfully demonstrates the potential of utilizing PCB waste to produce SiC micro-particles, which can enhance the thermal conductivity of cooling media. This approach not only provides a method for recycling electronic waste but also contributes to the development of more efficient cooling systems. Novelty/Originality of this article: This research introduces an innovative approach to recycling electronic waste by converting PCB waste into valuable SiC micro-particles, offering a novel method for improving cooling media in industrial applications.

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Published

2025-02-28

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Vol. 2 No. 1: (February) 2025

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